According to the number of combinational circuit chip package
Microelectronic packages can be divided into two categories: single-chip package (SCP) and multi-chip package (MCP). MCP refers to a multi-chip package with a lower level and MCM refers to a multi-chip package with a higher level. Chi-teng microelectronics focus on the production of high-end thick-film circuits, which uses MCM packaging technology, its product features small size, high temperature, widely used in aerospace, aviation, petroleum.

Classified by sealed material
Can be divided into polymer materials (ie plastic) and ceramic-based species. The thermal stability of the ceramic package, excellent thermal conductivity, good barrier to water molecules infiltration, it is the main high-reliability packaging methods; plastic packaging with process automation, low cost, thin package, etc., so the plastic package is Currently used technology in the market.

Classified by device and board interconnect
Package can be divided into pin-in type (PTH) and surface mount type (SMT) two categories. PTH pin pins for thin needle or sheet metal for insertion into the base or the circuit board guide hole for welding fixed; SMT devices are first affixed to the circuit board and then welded to the fixed, it has a gull wing type, the hook Type, straight-shaded metal pins, or electrode bump pins (also referred to as leadless devices).

According to pin shape distribution classification
Package components have unilateral pins, bilateral pins, four pins and the bottom of the four pins. Common single-sided pins are single-in-line package (SIP) and cross-pin package (ZIP); double-sided pin components are DIP, SOP, etc .; Flat Package (QFP), Bottom Pin with Metal Can (MCP) and Dot Array Package (PGA).